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Package Information
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Package Information
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Maximum solder ball diameter
measured parallel to Datum A.
4. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
5. Parallelism measurement
should exclude any effect of
marking.
6. Capacitors may not be present
on all devices.
7. Caution must be taken not to
short exposed metal capacitor
pads on package top.
CASE NO. 1842-04
Figure 44. MSC8144 Mechanical Information, 783-ball FC-PBGA Package
Product Documentation
MSC8144 Technical Data Sheet (MSC8144). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8144 device.
MSC8144 Reference Manual (MSC8144RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
Application Notes . Cover various programming topics related to the StarCore DSP core and the MSC8144 device.
SC3400 DSP Core Reference Manual . Covers the SC3400 core architecture, control registers, clock registers, program
control, and instruction set.
MSC8144 SC3400 DSP Core Subsystem Reference Manual . Covers core subsystem architecture, functionality, and
registers.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 16
Freescale Semiconductor
77
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MSC8144ESVT800B 制造商:Freescale Semiconductor 功能描述:DSP 32-BIT 800MHZ 800MIPS 783-PIN FCBGA EACH - Bulk 制造商:Freescale Semiconductor 功能描述:ENCRYPTION PACSUN R2.1 783FCPBGA
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